High density stackable and flexible substrate-based semiconductor device modules

ABSTRACT

A flexible carrier substrate assembly or module that facilitates stacking of multiple carrier substrates bearing semiconductor dice for high density electronic systems. After the dice are placed on the flexible substrate, a flexible support frame may be applied to the flexible substrate. The support frame includes conductive paths therethrough to connect to circuit traces running from the dice on the substrate to the substrate perimeter to interconnect superimposed carrier substrates. The flexible carrier substrates may be bent to a radius of any given curvature to conform to various non-planar regular and irregular surfaces. Furthermore, since the frame as well as the substrate may be flexible, multiple, flexible substrate assemblies may be stacked one on top of another wherein an upper assembly has a different radius than a lower module and any intermediate assemblies have progressively differing radii from bottom to top position.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to flexible circuits forsemiconductor devices and, more specifically, to a flexible carriersubstrate for use with semiconductor devices that facilitates highdensity stacking of the semiconductor devices.

2. State of the Art

Integrated circuit devices are commonly mounted on circuit boards andconnected to conductive patterns formed on the circuit boards. Wirebonds may be used to interconnect the integrated circuit (IC) devices totraces of a conductive pattern formed on a circuit board. Each wire isbonded to both a bond pad of the IC device and a terminal pad formed atthe end of a trace of the conductive pattern on the circuit board.

Wire bonding techniques are well known in the art and are highlyreliable in most applications. Unfortunately, in a few applications,difficulties do occur. These applications exist when the IC device issmall and the available area for connecting to the bond pads is limited.The process of reliably connecting wire bonds to small, closely-spacedbond pads is both tedious and expensive. Both ends of the wire bond mustbe accurately placed to avoid contacting adjacent pads on the IC deviceand the circuit board, respectively. Moreover, the wire must besufficiently welded to the conductive bond pads to ensure a secureconnection with good electrical contact and without damaging the ICdevice or the supporting circuit board.

To provide greater circuit density, circuit boards can be layeredtogether in stacks and then interconnected electrically. This results inthree-dimensional modules as the circuit boards are stacked one uponanother. In stacking circuit boards one upon another, board productiontechniques become even more complex than before. This is because eachlayer may be different, requiring different circuit layouts and puttinga strain on the ability of the assembly process to maintain dimensionaltolerances that would not be as troublesome in a single layerinterconnect layout assembly.

Another challenge in the art is an inability in some circumstances toprovide a flat, smooth surface on which to mount a printed circuitboard. Accordingly, flexible circuit boards have been developed topromote both lighter structures and greater adaptability to conformingto nonuniform surfaces. Unfortunately, the arrival of flexible circuitboards has resulted in other problems, such as the problem in joiningseveral boards while effecting and maintaining a proper interconnectionbetween the respective boards. Further, in some applications, wherepreclusion of ICs mounted on a lower circuit board from touching ahigher circuit board is required, providing a rigid assembly to supportthe stacked circuit boards is useful. Unfortunately, this approachcompromises the flexibility that would otherwise allow the circuitboards to conform to a non-planar surface.

One example of integrated circuit devices mounted upon flexible,stackable circuit boards to form semiconductor modules is disclosed inU.S. Pat. No. 5,440,171 entitled “Semiconductor Device withReinforcement,” issued Aug. 8, 1995. The '171 patent discloses a basicstructural unit that uses a flexible circuit board made from a polyimidefilm with circuit lines formed on both sides, typically using copperfoil. A supporting frame is provided and is bonded to the flexiblecircuit board with a heat resistant resin, such as a polyimide resin.Electrical connection is possible between the flexible circuit board andthe support frame, which may include a plurality of layers. Conductivethrough holes are provided so that electrical continuity may bemaintained between a semiconductor device mounted upon the flexiblecircuit board and either at least one other semiconductor device mountedon another flexible circuit board stacked within the module assembly, oran external structure upon which the entire basic structural unit ismounted. The semiconductor devices are electrically connected toelectrodes formed on the support frame.

Although a semiconductor device in the '171 patent is mounted on aflexible circuit board that is stackable with other circuit boards in athree-dimensional arrangement, the support frame attaching the stackablecircuit boards one to another is made from a rigid material that doesnot allow for any bending at all. For example, one type of framematerial suggested in the '171 patent is a ceramic such as alumina orsilicon nitride. Such materials may be used for high thermalconductivity to promote heat transfer from high power consumptionsemiconductor devices mounted on the flexible circuit board. However,because the support frame is made from an extremely rigid andnon-flexible material, the entire semiconductor structure utilizing thestackable circuit boards and support frames must necessarily comprise aseries of parallel, superimposed layers and must be mounted upon asubstantially planar surface. This prevents the assembly from conformingto non-planar surfaces.

Accordingly, what is needed is a flexible circuit board having anassociated support frame that overcomes the problems of the conventionalpractice of utilizing a rigid support frame and is readily adaptable forstacking in multiple layers. Additionally, the improved flexible circuitboard with stackable support frame should be more easily assembled andmounted than was possible with prior art structures when disposed uponnon-planar surfaces.

SUMMARY OF THE INVENTION

According to the present invention, a flexible substrate module orassembly is disclosed that facilitates stacking of multiple flexiblecarrier substrates to simplify the assembly of high density electronicsystems. Integrated circuit semiconductor devices in the form of chipsor dice are connected active surface side down to a flexible carriersubstrate in a so-called “flip-chip” orientation using solder bumps orother discrete conductive bumps or elements. Such conductive connectingelements may be formed either on the die itself or on the flexiblesubstrate. After the dice are placed on and secured to the flexiblecarrier substrate, a frame, preferably offering a significant degree offlexibility, is applied to the flexible carrier substrate to surroundthe perimeter thereof. The flexible frame includes conductive pathstherethrough in the form of conductively-plated through holes,electrical conductor-filled vias, or preformed conductive elements,which conductive paths connect to circuit traces on the flexible carriersubstrate extending from the electrical connections of the dice theretoon the interior region of the flexible carrier substrate to the flexiblecarrier substrate perimeter. This feature permits operational stackingof multiple flexible carrier substrates for cooperation betweensemiconductor dice mounted on different-level flexible carriersubstrates and between all components of the stacked assembly andexternal, higher-level packaging by providing electrical interconnectionbetween the various flexible carrier substrates. Since the flexiblecarrier substrates may be extremely flexible, they may be formed to aradius of substantially any given curvature, providing the ability toconform to various non-planar, arcuate or non-arcuate, regular orirregular surfaces. Further, the flexible carrier substrates exhibitsubstantial flexibility so as to provide significant bending angles,permitting mounting of the flexible carrier substrates to manystructures having non-planar surfaces. Furthermore, since the perimeterframe as well as the carrier substrate may be flexible, multipleflexible carrier substrate modules, each comprising a flexible carriersubstrate and associated frame, may be stacked one on top of another insuperimposed arcuate configurations, wherein the top module may have asmaller or larger radius of curvature than the bottom module and anymodules in between have progressively differing radii from bottom to topposition.

Mounting multiple modules in a stacked configuration with differingmodule radii may be accomplished by attaching first ends of a pluralityof modules comprising superimposed flexible carrier substrates andsupport frames and then sequentially attaching second ends of themodules after a given radius is established for each lower module. In analternative assembly technique, the first and second ends of a firstflexible carrier substrate may be attached to a desired surface. Next, aflexible support frame is then attached to a first end and then a secondend of the first flexible carrier substrate. Next, a second flexiblecarrier substrate may be attached to the first and second ends of thefirst frame and the process repeated in layers until a desired,completed structure is formed.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a perspective view of a flexible carrier substrate accordingto the invention having semiconductor dice conductively attached to anupper surface thereof;

FIG. 2 depicts a flexible carrier substrate assembly, or module,according to the invention having the dice as well as a flexible supportframe attached to the flexible carrier substrate;

FIG. 3 illustrates a perspective view of a flexible frame according tothe invention having conductive vias extending vertically therethrough;

FIG. 4 illustrates a side view of a plurality of stacked flexiblemodules according to the invention;

FIG. 5 depicts how a first end of one flexible carrier substrate isattached to an edge of a flexible support frame while the second end ofthe substrate is then attached to the second end of the flexible supportframe;

FIG. 6 depicts a first flexible carrier substrate attached to a secondflexible carrier substrate via an interposed flexible support framewhere the first flexible carrier substrate is curved to a radiusdifferent than that of the second substrate;

FIG. 7 depicts a plurality of flexible modules secured to an angularnon-planar surface;

FIG. 8 depicts a plurality of flexible carrier substrates mounted in avertical stack laminate arrangement;

FIG. 9 depicts plurality of superimposed flexible carrier substrateswith attached dies mounted in abstantially planar, low-profile, laminatedesign;

FIG. 10 depicts a plurality of flexible carrier substrates bearing diceand mounted in a substantially planar interleaved laminate design;

FIG. 11 depicts a plurality of dice mounted in a flexible carriersubstrate assembly wherein at least one die is mounted in an invertedposition upon a flexible carrier substrate relative to the other dice;and

FIG. 12 is a block diagram of an electronic system incorporating aflexible stackable module according to the invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 depicts a flexible carrier substrate assembly or module 10including a flexible carrier substrate 12. A plurality of semiconductordice 14 is attached to the surface of flexible carrier substrate 12 in aflip-chip orientation. Semiconductor dice 14 may be selected from anytype of semiconductor device such as, for example, memory devices,central processing units, signal processing units, controller devices,or any combination of these or other devices.

Flexible carrier substrate 12 may be fabricated from any type offlexible, conductive material such as a flexible laminate comprising ametal cladding adhered to a dielectric substrate, such as, for example,a polyimide film, a resin-impregnated fabric or a synthetic fabric. Theflexible laminate typically is thinner than a rigid composite and can befreely formed over, or conformed to, a particular non-planar surface orstructure. The flexible laminate may be less than 0.25 mm in totalthickness. The dielectric thickness selection is significant to the enduse for the carrier substrate in terms of required flexibility. Thinnermaterials may be used for dynamic or continuous flexing applications,while thicker materials may be used for intermittent flexing and flexingduring installation, or where flexing with some degree of structuralself-support is desired or required. Dynamic or continuous flexingapplications may include, but are not limited to, repeatedly andfrequently opening and closing connection points such as entryways,portable clamshell computer hinge points, personal electronic organizerhinge points, or cellular phone hinge points. Occasional flexingapplications may include portable clamshell computer boards, personalelectronic organizer boards, cellular phone boards, desktop computerboards, server boards and motor vehicle and aircraft-mounted computersystem boards.

The metal cladding may include, without limitation, copper foil,beryllium copper, aluminum, and Invar®, and conductive polymer thickfilms may also be employed to fabricate conductors. The fabrication anddesign of the flexible substrate 12 in this particular embodiment are apolyimide film with conductive circuit traces 20 formed on both sidesusing copper foil. The circuit traces may be formed by applying either apositive or negative photo resist on the foil, then patterning the photoresist and etching away exposed portions of the foil to define thetraces. Afterwards, additional processing may be performed on flexiblesubstrate 12 to place additional metals or other conductive materials atselected positions, such as bumped pads, for mechanical and electricalconnection of the semiconductor dice 14 to traces 20 on flexiblesubstrate 12.

Semiconductor dice 14 are attached to the traces 20 on a surface offlexible carrier substrate 12 using conventional attachment methods suchas, for example, conductive or conductor-filled adhesive elements,solder bumps, copper or gold bumps, anisotropically conductive adhesivefilms, or tape automated bonding (TAB) structures comprising conductorscarried on a flexible dielectric film. Circuit traces 20 extend fromlocations of semiconductor dice 14 attached to flexible carriersubstrate 12 to locations at the outer perimeter of carrier substrate 12under or over the locations where a flexible support frame 16 isattached to flexible carrier substrate 12 as shown in FIG. 2. Flexiblesupport frame 16 can be made of the same material as that of flexiblecarrier substrate 12, or can be made from a different material withdesired thermal resistivity and electrical dielectric properties as wellas a similar coefficient of thermal expansion (CTE) with respect to thematerial of flexible carrier substrate 12. Many known polymers, resinsand laminates exhibit such desirable characteristics, as known to thoseof ordinary skill in the art. Additionally, conductive paths 18 in theform of plated through holes, conductively-filled vias, or preformedconductive elements are formed through flexible support frame 16 forinterconnecting semiconductor dice 14 to other devices external to thesemiconductor module formed by assembly 10, such as to a computer systemin the event the semiconductor dies are DRAM chips, microprocessors,video chips, or logic chips, or to higher-level packaging forcooperation with other components in other electronic applications suchas cellular phones, television systems, video cassette recorders, andthe like. Circuit traces 20 are shown to connect the severalsemiconductor dice 14 to selected conductive paths 18 so that thesemiconductor dice 14 can be connected to either other semiconductordice 14 of other assemblies 10 within a stack or to other, externalcomponents as previously mentioned.

FIG. 3 depicts a perspective view of flexible support frame 16 withconductive paths 18 extending transversely through in the form of platedthrough holes, conductively filled vias or preformed conductiveelements. Aligned conductive paths 18 extending through superimposedflexible support frames 16 provide horizontally electrically isolatedvertical conductivity between superimposed assemblies 10. Eachconductive path 18 may range in size (diameter or lateral breadth), byway of example only, from about 0.05 mm to 0.8 mm. The only upperconstraint on the size for conductive path 18 is that it be no largerthan otherwise necessary to prevent damaging the frame or reducing theframe's support strength. If a plated through hole is employed asconductive path 18, the metal used to plate the interior walls of eachplated through hole such as, for example, copper, may have a minimumwall thickness of about 25 micrometers, or about 1 mil. A lesserthickness is possible as long as the plating employs a thickness ofmaterial adequate to provide the desired current carrying capacitywithout excessive resistance. If a conductive filler is employed in viasto form conductive paths 18, the filler may comprise a metal or aconductive or conductor-filled epoxy disposed in each via, or preformed,discrete conductive elements may be inserted.

FIG. 4 depicts a cross-sectional schematic diagram of a plurality offlexible carrier substrates 12, each having a plurality of semiconductordice 14 placed upon the surface thereof, flexible carrier substrates 12,being interspaced with flexible support frames 16. Conductive paths 18provide electrical interconnection between semiconductor dice 14 on onesubstrate 12 and those on another substrate 12. The use of flexiblesupport frames 16 provides structural strength, without addingsignificant weight, in comparison to prior art approaches that employdense, heavy, rigid ceramic or resin support frames. Additionally,reliable electrical interconnection is provided by the conductive paths18 between the various flexible carrier substrates 12 in a stack.Further, the flexible carrier substrate 12 provides a relatively smallerresulting module, with lighter weight, and greater device or circuitdensity. With increased packing density, improved circuit performance isachieved. Additionally, the stacking process is simple to implement andcan be used for combining a plurality of flexible assemblies 10 in theform of SIMM or DIMM modules to form a larger memory module.

FIG. 5 is a schematic diagram of how flexible carrier substrate 12 maybe attached sequentially to a first end of flexible support frame 16 andthen to a second end of flexible support frame 16. In this manner,rather than attaching all edges of a flexible support frame 16 to theperimeter of a flexible carrier substrate 12 simultaneously, an assembly10 can first be molded to conform to a particular radius or othernon-planar shape. For example, FIG. 6 is a cross-sectional diagram oftwo arcuate flexible carrier substrates 12 interconnected via a flexiblesupport frame 16 where a relatively longer, top substrate 12 has asmaller radius of curvature than the bottom substrate 12. R2 is greaterthan R1 where R1 is the radius of the top substrate 12 and R2 is theradius of the bottom substrate 12, so that the upper substrate 12 “bows”away from the lower one to provide greater clearance therebetween. Ifdesired, the substrates 12 may be sized to provide concentric curveswhen in superimposition so as to exhibit substantially constant spacebetween superimposed substrates 12. Of course, a substrate 12 may becurved to a radius to conform to a mounting surface 13, as shown.

In an alternative embodiment, support frame 16 can be made from asemi-rigid material that is pliable such as a thermosetting orthermoplastic resin. With the pliability of support frame 16, it can bemolded to a particular shape before placing a flexible carrier substrate12 upon it. Further, the pliable material utilized in support frame 16can be cured to shape in order to provide rigidity and greater strengthafter the semiconductor modules 10 are fabricated with the variousflexible carrier substrates 12 layered in a desired configuration.

Another example that takes advantage of the technique of attaching thefirst end of a flexible carrier substrate 12 to a first portion ofsupport frame 16 and then attaching a subsequent end of flexible carriersubstrate 12 to a second portion of support frame 16 is shown in FIG. 7.FIG. 7 is a cross-sectional schematic diagram of a plurality ofsuperimposed flexible carrier substrates 12, each bearing a plurality ofsemiconductor dice 14. Support frames 16 are used to support theflexible carrier substrates 12 and are configured in such a manner thata bend of 90° is achieved over the adjoining faces of structure 22. Suchconfigurations and arrangements as well as others are also possibleusing the combination of a plurality of flexible carrier substrates 12with a multiple substrate support frame 116 as shown alternatively inFIG. 7. These various configurations are possible in that both multiplesubstrate support frame 116 and flexible carrier substrates 12 can beutilized in a plurality of combinations where either the flexiblecarrier substrates 12 are placed on structure 22 already secured tosupport frame 116, or support frame 116 may be arranged over aparticular surface such as structure 22 with flexible carrier substrates12 then subsequently secured to support frame 116.

FIG. 8 is a cross-sectional schematic diagram of a plurality of flexiblecarrier substrates 12 mounted and stacked in a laminate form. A single,preferably rigid, base substrate 24 is provided that can be selectedfrom any type of rigid printed circuit board material such as, forexample, fiberglass resin boards including FR-4 and FR-5, silicon,ceramics, or molybdenum. Mounted to the surface of base substrate 24 maybe a second carrier substrate 26. Carrier substrate 26 can be eitherflexible or rigid, depending upon the requirements of the design. Aplurality of semiconductor dice 14 is mounted to carrier substrate 26.Semiconductor dice 14 are mounted to carrier substrate 26 in a surfacemount fashion such as by using tape-automated bonding (TAB) techniques.Alternatively, base substrate 24 may be provided with traces and dice 14mounted directly thereto.

Alternatively, semiconductor dice 14 may be mounted using solder ballsor other discrete conductive elements. A first flexible carriersubstrate 12 is provided that connects at each end thereof to thesurface of base substrate 24 and covers the dice carried by substrate 26(or 24, as the case may be). Interconnect conductor traces 25 arefabricated on the surface of substrate 24 to allow interconnectionbetween the semiconductor dice 14 placed on first flexible carriersubstrate 12 to the dice 14 placed on carrier substrate 26 as well asany other dice connected to base substrate 24, or to other componentsexternal to base substrate 24. Next, a second flexible carrier substrate12 is disposed over first flexible carrier substrate 12 and connected ateach end there of to the surface of substrate 24.

A plurality of semiconductor dice 28 is attached to second flexiblecarrier substrate 12 and electrically connected to conductor traces 25.Semiconductor dice 28 may, by way of example, be attached to the surfaceof second flexible carrier substrate 12 by solder balls 30. Solder balls30 are generally formed of a lead-tin or lead-silver alloy on bond padsof a die 28, and then reflowed to provide electrical and mechanicalconnection to terminals or contact pads on the surface of secondflexible carrier substrate 12. Other discrete conductive elements asknown in the art may be employed in lieu of solder balls 30. Finally, acover 29 may be provided over the entire assembly. This can be anotherflexible substrate without circuit traces thereon, having its endsattached to the surface of base substrate 24. Alternatively, the cover29 may be a hermetic, resin sealant that protects the dice 14 and 28from moisture and dust, or may comprise a preformed dome-shaped memberof any other suitable material sealed at its periphery to base substrate24. The arrangement of FIG. 8 has the advantage of eliminating the needfor support frames 16. Further, this approach facilitates connection ofall of the flexible carrier substrates 12 to a single base substrate 24.Further still, the laminated but frameless design of FIG. 8 makes iteasy to replace individual flexible carrier substrates as required.

FIG. 9 is a cross-sectional schematic diagram of a similar arrangementof that of FIG. 8, but where the plurality of substrates 12 areconnected to rigid base substrate 24 in a more tapered, lower profile,design. In this example, a semiconductor die 28 can be attached totraces 25 on the surface of a rigid substrate 24 via a plurality ofsolder balls 30 or other discrete conductive elements. Next, a flexiblecarrier substrate 12 is placed over semiconductor die 28 and attached ina substantially planar arrangement over that of FIG. 8. At least onesemiconductor die 14 can be attached to substrate 12. Additionalflexible carrier substrates 12 can be applied to rigid substrate 24 anda laminated, more planar design can be achieved with a smaller verticalheight. This arrangement is desirable when the dice 14 and 28 are ofsuch a dimension that a nearly flat surface can be achieved in astacking arrangement and a low profile, very dense structure is desired,as for SIMM or DIMM memory modules, laptop computers, personal digitalassistants, cellular phones, and other compact electronic devices. Thisembodiment may be utilized when space is limited and a high chip stackcannot fit within the volume constraints of the electronic device.Further, this arrangement reduces electrical parasitics, and the closespacing of the dice 14 leads to better electrical performance.

In yet additional embodiments, the flexible carrier substrates 12 can beinterleaved so that a plurality of semiconductor dies 14 are placed in asubstantially coplanar arrangement with one another as shown in FIG. 10.This arrangement is also frameless and may again employ a base substrate24. Yet another embodiment is depicted in FIG. 11, where selected dice14 of a plurality of dice 14 are placed upon the base substrate 24 in aconventional flip-chip orientation while one or more additional dice 14are mounted in an upside down flip-chip orientation to a bottom surfaceof a flexible carrier substrate 12 that is then attached at its ends tobase substrate 24 either with or without a frame. In such anarrangement, the flexible carrier substrate 12 also serves as a coverfor the dice 14 mounted to base substrate 24.

The use of a flexible carrier substrate of the invention rather than arigid dielectric substrate such as a conventional printed circuit boardhas several advantages. These advantages include increased mechanicalstrength and vibration-dampening capability, as well as improveddielectric properties in comparison to rigid boards having the samerelative thickness. Also, they provide space savings and weightreduction over the prior rigid dielectrics used. Additionally, greaterimpedance control and contact resolution (by way of example, reductionof pitch to 8 to 6 mils and extendible to 4 mils) can be achieved usingthe flexible substrates, providing superior electrical performance,which is also facilitated by the tighter geometries and therefore highercircuit densities which may be obtained using the flexible substrates.Additionally, mechanical flexing of the substrates may be readily usedto conform to unusual and complex structural geometries not otherwisepossible using conventional rigid materials. This flexing can be eithercontinuous (i.e., a bend along a single radius) or intermittent orvariable along the length of a flexible substrate. Further, whenmultiple flexible substrates are stacked upon one another, particularlywhen using support frames, additional rigidity of the overall module isachieved. Unlike conventional, rigid substrate approaches, wherein therigidity is primarily in a single plane and bending or torsionaldegradation of a circuit structure may still occur, rigidity using thepresent invention can be achieved in an arcuate configuration or byusing an abrupt, non-planar directional change that would not otherwisebe possible using rigid, planar substrates. Properly engineered andconfigured as required with appropriate cross-members, an assembly offlexible substrates with one or more supporting frames according to theinvention may provide rigidity under loads applied from any direction orparticularly critical directions. Additionally, the flexible carriersubstrate of the invention in combination with a stackable support framefacilitates fabrication of the assembly upon structures exhibitinggreater non-planarity than was previously possible using conventionaltechniques for mounting, support and electrical connection of dice.

FIG. 12 depicts an electronic system 130 including an input device 132and an output device 134 coupled to a processor device 136 which, inturn, is coupled to a memory device 138 incorporating a flexiblestackable assembly 10 of any of the various embodiments thereof asdepicted in, and described with respect to, FIGS. 1-11. For example, anentire, operable computer system may be assembled using stackedassemblies of the present invention. By way of example only, amicroprocessor may be placed in one flexible carrier substrate level,which includes the appropriate and necessary supporting logic, memorydevices may be placed on another flexible carrier substrate level, soundand video processors may be placed on another flexible carrier substratelevel, and the input/output control devices can be placed on yet anotherflexible carrier substrate level.

Although the present invention has been described with reference toparticular embodiments, the invention is not limited. Many additions,modifications and deletions to the embodiments disclosed herein may beeffected without departing from the scope of the invention as defined bythe claims appended hereto. Moreover, selected features from oneembodiment may be employed with selected features from anotherembodiment, again within the scope of the invention.

What is claimed is:
 1. A semiconductor device module, comprising: aflexible carrier substrate having a surface portion carrying conductivetraces thereon; at least one semiconductor device connected to at leastsome of said conductive traces; and a flexible support frame attached tosaid flexible carrier substrate, said flexible support frame including aplurality of conductive paths therethrough for providing electricalcoupling of said at least one semiconductor device to circuitry externalto said flexible carrier substrate.
 2. The module according to claim 1,wherein said flexible carrier substrate exhibits a first radius ofcurvature.
 3. The module according to claim 1, further comprising asecond flexible carrier substrate having a surface mounted to saidflexible support frame.
 4. The module according to claim 3, wherein saidflexible carrier substrate exhibits a first radius of curvature and saidsecond flexible carrier substrate exhibits a second radius of curvature.5. The module according to claim 3, wherein said second flexible Ycarrier substrate has at least one semiconductor device attached to asurface thereof.
 6. The module according to claim 3 wherein saidflexible carrier substrate is shaped in a non-planar configuration andsaid second flexible carrier substrate substantially conforms to a shapeof said flexible carrier substrate.
 7. A semiconductor device module,comprising: a flexible carrier substrate having a surface portioncarrying conductive traces thereon; at least one semiconductor deviceconnected to said conductive traces; and a flexible support attached tosaid flexible carrier substrate along an outer perimeter edge thereof,said flexible support having at least one substantially verticalconductive path therethrough to provide electrical coupling of saidconductive traces to circuitry external to said flexible carriersubstrate.
 8. The semiconductor device module according to claim 7,wherein said at least one conductive path is selected from the groupcomprising plated through holes, conductively-filled vias and preformedconductive elements.
 9. A semiconductor device module, comprising: aflexible carrier substrate having a surface portion carrying conductivetraces thereon; at least one semiconductor device connected to saidconductive traces using tape automated bonding; and a flexible supportattached to said flexible carrier substrate, said support having atleast one conductive path for providing electrical coupling of saidconductive traces to circuitry external to said flexible carriersubstrate.
 10. A semiconductor device module, comprising: a flexiblecarrier substrate having a surface portion carrying conductive tracesthereon; at least one semiconductor device connected to said conductivetraces in a flip chip arrangement; and a flexible support attached tosaid substrate to support a second substrate thereon, said supporthaving a plurality of conductive paths therethrough for providingelectrical coupling of said conductive traces to said second substrate.11. A semiconductor device module, comprising: a flexible substratehaving a surface portion carrying conductive traces thereon; at leastone semiconductor device connected to said conductive traces; and apliable support, attached to said substrate, to support a secondsubstrate, said pliable support having conductive paths for providingelectrical coupling of said conductive traces to said second substrateand wherein said pliable support is curable to a rigid condition. 12.The module according to claim 3, wherein at least one of said flexiblecarrier substrate and said second flexible carrier substrate isconfigured to include a substantially 90° arcuate section.
 13. Themodule according to claim 1, wherein said flexible carrier substrate isconfigured to include a substantially 90° arcuate section.
 14. Themodule according to claim 1, wherein said flexible carrier substrate hassufficient flex to form at least a substantially 90° arcuate bend. 15.The module according to claim 14, wherein said flexible support framehas sufficient flex to conform with said flexible carrier substrate. 16.The semiconductor device module of claim 1, wherein the flexible supportframe is attached to the flexible carrier substrate at least along asubstantial majority of a peripheral edge of the flexible carriersubstrate.
 17. The semiconductor device module of claim 3, furthercomprising a second flexible support frame attached to the secondflexible carrier substrate, and a third flexible carrier substratemounted on the second flexible support frame in a laminate manner.